MPC8245EC datasheet(50/68 Pages) FREESCALE

50 / 68 page

MPC8245 Integrated Processor Hardware Specifications, Rev. 10

Freescale Semiconductor

System Design

7.8

Thermal Management

This section provides thermal management information for the tape ball grid array (TBGA) package for

air-cooled applications. Depending on the application environment and the operating frequency, heat sinks

may be required to maintain junction temperature within specifications. Proper thermal control design

primarily depends on the system-level design: the heat sink, airflow, and thermal interface material. To

reduce the die-junction temperature, heat sinks can be attached to the package by several methods:

adhesive, spring clip to holes in the printed-circuit board or package, or mounting clip and screw assembly.

Figure 27 displays a package-exploded cross-sectional view of a TBGA package with several heat sink

options.

Figure 27. Package-Exploded Cross-Sectional View with Several Heat Sink Options

Figure 28 depicts the die junction-to-ambient thermal resistance for four typical cases:

•

A heat sink is not attached to the TBGA package, and there exists high board-level thermal loading

from adjacent components.

•

A heat sink is not attached to the TBGA package, and there is low board-level thermal loading from

adjacent components.

•

A heat sink (for example, ChipCoolers) is attached to the TBGA package, and there is high

board-level thermal loading from adjacent components.

•

A heat sink (for example, ChipCoolers) is attached to the TBGA package, and there is low

board-level thermal loading from adjacent components.

Thermal Interface

Heat Sink

TBGA Package

Heat Sink

Clip

Printed-Circuit Board

Option

Material

Die

Adhesive or

MPC8245EC 데이터시트(PDF) 50 Page - Freescale Semiconductor, Inc