| 전자부품 데이터시트 검색엔진 |
|
C2.5X6.3MM-RAD 데이터시트(PDF) 32 Page - Silicon Laboratories |
|
|
|||||||||||||||||||||||||||||
C2.5X6.3MM-RAD 데이터시트(HTML) 32 Page - Silicon Laboratories |
|
32 / 38 page ![]() Si3226/7 Si3208/9 32 Preliminary Rev. 0.33 35 NC No Connect. 36 AGND I Analog Ground. 37 IC Internal connection; leave to float. 38 IC Internal connection; leave to float. 39 VBAT_1 I Operating Battery Voltage Channel 1 Input. 40 IC Internal connection; leave to float. epad Exposed Die Attach Paddle. For adequate thermal management, the exposed die paddle should be soldered to a printed circuit board pad that is connected to an electrically-isolated low-impedance inner layer and/or back- side thermal plane(s) using multiple thermal vias. Do not connect this pad to ground. Table 18. Si3208/9 Pin Descriptions (Continued) QFN Pin # Symbol I/O Description |
|
링크 URL |
| ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크 투 데이터시트 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |