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Rev. C | Page 17 of 20

OUTLINE DIMENSIONS

CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

DIMENSIONS PER JEDEC STANDARDS MO-006-AF

0.500 (12.70)

MIN

0.185 (4.70)

0.165 (4.19)

REFERENCE PLANE

0.050 (1.27) MAX

0.040 (1.02) MAX

0.021 (0.53)

0.016 (0.40)

1

0.034 (0.86)

0.025 (0.64)

0.045 (1.14)

0.025 (0.65)

0.160 (4.06)

0.110 (2.79)

6

2

8

7

5

4

3

0.115

(2.92)

BSC

9

10

0.230 (5.84)

BSC

BASE & SEATING PLANE

36° BSC

Figure 28. 10-Pin Metal Header Package [TO-100]

(H-10)

Dimensions shown in inches and (millimeters)

CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

14

1

7

8

0.310 (7.87)

0.220 (5.59)

PIN 1

0.080 (2.03) MAX

0.005 (0.13) MIN

SEATING

PLANE

0.023 (0.58)

0.014 (0.36)

0.060 (1.52)

0.015 (0.38)

0.200 (5.08)

MAX

0.200 (5.08)

0.125 (3.18)

0.070 (1.78)

0.030 (0.76)

0.100 (2.54)

BSC

0.150

(3.81)

MIN

0.765 (19.43) MAX

0.320 (8.13)

0.290 (7.37)

0.015 (0.38)

0.008 (0.20)

Figure 29. 14-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP]

(D-14)

Dimensions shown in inches and (millimeters)

CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

1

20

4

9

8

13

19

14

3

18

BOTTOM

VIEW

0.028 (0.71)

0.022 (0.56)

45° TYP

0.015 (0.38)

MIN

0.055 (1.40)

0.045 (1.14)

0.050 (1.27)

BSC

0.075 (1.91)

REF

0.011 (0.28)

0.007 (0.18)

R TYP

0.095 (2.41)

0.075 (1.90)

0.100 (2.54) REF

0.200 (5.08)

REF

0.150 (3.81)

BSC

0.075 (1.91)

REF

0.358 (9.09)

0.342 (8.69)

SQ

0.358

(9.09)

MAX

SQ

0.100 (2.54)

0.064 (1.63)

0.088 (2.24)

0.054 (1.37)

Figure 30. 20-Terminal Ceramic Leadless Chip Carrier [LCC]

(E-20-1)

Dimensions shown in inches and (millimeters)