ADP1754/ADP1755

Data Sheet

Rev. F | Page 18 of 20

PCB LAYOUT CONSIDERATIONS

Heat dissipation from the package can be improved by increas-

ing the amount of copper attached to the pins of the ADP1754/

ADP1755. However, as shown in Table 6, a point of diminishing

returns is eventually reached, beyond which an increase in the

copper size does not yield significant heat dissipation benefits.

Here are a few general tips when designing PCBs:

•

Place the input capacitor as close as possible to the VIN

and GND pins.

•

Place the output capacitor as close as possible to the VOUT

and GND pins.

•

Place the soft start capacitor as close as possible to the SS pin.

•

Connect the load as close as possible to the VOUT and

SENSE pins (ADP1754) or to the VOUT and ADJ pins

(ADP1755).

Use of 0603 or 0805 size capacitors and resistors achieves the

smallest possible footprint solution on boards where area is

limited.

Figure 46. Evaluation Board

Figure 47. Typical Board Layout—Top Side

Figure 48. Typical Board Layout—Bottom Side