| 전자부품 데이터시트 검색엔진 |
|
AS3953 데이터시트(PDF) 39 Page - ams AG |
|
|
|||||||||||||||||||||||||||||
AS3953 데이터시트(HTML) 39 Page - ams AG |
|
39 / 42 page ![]() www.ams.com Revision 1.0 39 - 42 AS3953 Datasheet - P ac k a ge D ra w i n gs a nd M a r ki n gs Figure 17. Gold Bumped Dies 11-pins Table 12. Specification for Gold Bumps Item Min Max Unit Backgrinded Wafer Height (excl bimp height) 100 µm Bump Height 13 17 µm Height Coplanarity for within Wafer < 4 µm Height Coplanarity for within Die < 2 µm Surface roughness <= 3 µm Hardness 35 65 Hv Shear Force 8 >= mg/µm 2 |
|
링크 URL |
| ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크 투 데이터시트 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |