AD9742ARURL7 datasheet(30/32 Pages) AD

30 / 32 page

AD9742

Data Sheet

Rev. C | Page 30 of 32

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

EXPOSED

PAD

PIN 1

INDICATOR

3.25

3.10 SQ

2.95

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.50

0.40

0.30

0.25 MIN

Figure 57. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

5 mm × 5 mm Body, Very Very Thin Quad

(CP-32-7)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

AD9742AR

−40°C to +85°C

28-Lead Standard Small Outline Package [SOIC]

RW-28

AD9742ARZ

−40°C to +85°C

28-Lead Standard Small Outline Package [SOIC]

RW-28

AD9742ARZRL

−40°C to +85°C

28-Lead Standard Small Outline Package [SOIC]

RW-28

AD9742ARU

−40°C to +85°C

28-Lead Thin Shrink Small Outline Package [TSSOP]

RU-28

AD9742ARURL7

−40°C to +85°C

28-Lead Thin Shrink Small Outline Package [TSSOP]

RU-28

AD9742ARUZ

−40°C to +85°C

28-Lead Thin Shrink Small Outline Package [TSSOP]

RU-28

AD9742ARUZRL7

−40°C to +85°C

28-Lead Thin Shrink Small Outline Package [TSSOP]

RU-28

AD9742ACPZ

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-32-7

AD9742ACPZRL7

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-32-7

AD9742-EBZ

Evaluation Board [SOIC]

AD9742ACP-PCBZ

Evaluation Board [LFCSP]

Z = RoHS Compliant Part.

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