LTC4061



4061fd

package DescripTion

MOSFET, MP1, is used to prevent back conducting into the

USB port when a wall adapter is present and a Schottky

diode, D1, is used to prevent USB power loss through the

1k

Ω pull-down resistor.

Typically a wall adapter can supply more current than

the 500mA limited USB port. Therefore, an N-channel

MOSFET, MN1, and an extra 3.3k

Ω program resistor are

used to increase the charge current to 800mA when the

wall adapter is present.

+

D1

PROG

3.3k

2k

MN1

5V WALL

ADAPTER

USB POWER

MP1

4061 F08

BAT

LTC4061

1.25k

Li-Ion

BATTERY

SYSTEM

LOAD

1k

C/5

Figure8.CombiningWallAdapterandUSBPower

3.00 0.10

(4 SIDES)

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).

CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

0.40 0.10

BOTTOM VIEW—EXPOSED PAD

1.65 0.10

(2 SIDES)

0.75 0.05

R = 0.125

TYP

2.38 0.10

(2 SIDES)

1

5

10

6

PIN 1

TOP MARK

(SEE NOTE 6)

0.200 REF

0.00 – 0.05

(DD) DFN REV C 0310

0.25 0.05

2.38 0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.65 0.05

(2 SIDES)

2.15 0.05

0.50

BSC

0.70 0.05

3.55 0.05

PACKAGE

OUTLINE

0.25 0.05

0.50 BSC

PIN 1 NOTCH

R = 0.20 OR

0.35 45

CHAMFER

DDPackage

10-LeadPlasticDFN(3mm

×3mm)

(Reference LTC DWG # 05-08-1699 Rev C)