©2012 Littelfuse, Inc.

Specifications are subject to change without notice.

80

Revision: March 20, 2012

SP723 Lead-Free/Green Series

General Purpose ESD Protection - SP723 Series

Part Numbering System

Lead Plating

Matte Tin

Lead Material

Copper Alloy

Lead Coplanarity

0.004 inches (0.102mm)

Substitute Material

Silicon

Body Material

Molded Epoxy

Flammability

UL 94 V-0

Product Characteristics

Ordering Information

Package Dimensions — Small Outline Plastic Packages (SOIC)

Notes:

1.

Symbols are defined in the “MO Series Symbol List” in Section 2.2 of

Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold

flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side.

4. Dimension “E” does not include interlead flash or protrusions. Inter-lead flash

and protrusions shall not exceed 0.25mm (0.010 inch) per side.

5. The chamfer on the body is optional. If it is not present, a visual index feature

must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7.

“N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The eadl width “B”, as measured 0.36mm (0.014 inch) or greater above the

seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).

10. Controlling dimension:MILLIMETER. Converted inch dimensions are not

necessarily exact.

Package

SOIC

Pins

8

JEDEC

MS-012

Millimeters

Inches

Notes

Min

Max

Min

Max

A

1.35

1.75

0.0532

0.0688

-

A1

0.10

0.25

0.0040

0.0098

-

B

0.33

0.51

0.013

0.020

9

C

0.19

0.25

0.0075

0.0098

-

D

4.80

5.00

0.1890

0.1968

3

E

3.80

4.00

0.1497

0.1574

4

e

1.27 BSC

0.050 BSC

-

H

5.80

6.20

0.2284

0.2440

-

h

0.25

0.50

0.0099

0.0196

5

L

0.40

1.27

0.016

0.050

6

N

88

7

μ

0º

8º

0º

8º

-

INDEX

AREA

E

D

N

12

3

-B-

0.25(0.010)

C A

M

BS

e

-A-

L

B

M

-C-

A1

A

SEATING PLANE

0.10(0.004)

C

H

0.25(0.010)

B

M

M

μ

Part Number

Temp. Range (ºC)

Package

Environmental

Informaton

Marking

Min. Order

SP723APP

-40 to 105

8 Ld PDIP

Lead-free

2000

SP723ABG

-40 to 105

8 Ld SOIC

Green

1960

SP723ABTG

-40 to 105

8 Ld SOIC Tape and Reel

Green

2500

SP 723

Series

Package

P=Lead Free

T= Tape and Reel

AB = 8 Ld SOIC

AP = 8 Ld PDIP

G=Green

Silicon Protection

Family of

TVS Diode Arrays

** * *

Notes:

1. SP723AP(P) means device marking either SP723AP or SP723APP.

2. SP723A(B)G means device marking either SP723AG or SP723ABG which are good for types SP723ABG and SP723ABTG.