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ADP5585ACBZ-00-R7 데이터시트(PDF) 6 Page - Analog Devices |
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ADP5585ACBZ-00-R7 데이터시트(HTML) 6 Page - Analog Devices |
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6 / 40 page ![]() ADP5585 Data Sheet Rev. C | Page 6 of 40 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS INT RST/R5 1 A B C D 23 4 C1 R2 VDD C2 SDA R4 C3 R1 SCL C4 R0 GND C0 R3 BALL A1 CORNER TOP VIEW (BALL SIDE DOWN) Not to Scale 12 11 10 1 3 4 VDD RST(R5) C4 9 C3 R4 R2 2 R3 R1 TOP VIEW Not to Scale NOTES 1. THE EXPOSED PAD IS NOT CONNECTED. IT IS RECOMMENDED TO CONNECT THE EXPOSED PAD TO GROUND FOR THERMAL DISSIPATION. Figure 3. WLCSP Pin Configuration Figure 4. LFCSP Pin Configuration Table 4. Pin Function Descriptions Pin No. WLCSP LFCSP Mnemonic Description D1 1 R4 GPIO 5 (GPIO Alternate Function: RESET1). This pin functions as Row 4 when used as a keypad. D2 2 R3 GPIO 4 (GPIO Alternate Function: Logic Block Input LC, PWM_OUT). This pin functions as Row 3 when used as a keypad. C1 3 R2 GPIO 3 (GPIO Alternate Function: Logic Block Input LB). This pin functions as Row 2 when used as a keypad. C2 4 R1 GPIO 2 (GPIO Alternate Function: Logic Block Input LA). This pin functions as Row 1 when used as a keypad. B1 5 R0 GPIO 1 (GPIO Alternate Function: Logic Block Output LY). This pin functions as Row 0 when used as a keypad. B4 6 C0 GPIO 7. This pin functions as Column 0 when used as a keypad. C3 7 C1 GPIO 8. This pin functions as Column 1 when used as a keypad. C4 8 C2 GPIO 9. This pin functions as Column 2 when used as a keypad. D3 9 C3 GPIO 10 (GPIO Alternate Function: PWM_IN). This pin functions as Column 3 when used as a keypad. D4 10 C4 GPIO 11 (GPIO Alternate Function: RESET2). This pin functions as Column 4 when used as a keypad. B3 11 RST/R5 Input Reset Signal. To expand the keypad matrix, select the ADP5585ACBZ-01-R7 or the ADP5585ACPZ-01-R7 device model for this pin to function as GPIO 6/Row 5. A1 12 VDD Supply Voltage Input. A4 13 GND Ground. A2 14 SDA I2C Data Input/Output. A3 15 SCL I2C Clock Input. B2 16 INT Open-Drain Interrupt Output. EP EP Exposed Pad. The exposed pad is not connected. It is recommended to connect the exposed pad to ground for thermal dissipation. |
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