. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator

LP2954, LP2954A

SNVS096D – JUNE 1999 – REVISED MARCH 2013

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Absolute Maximum Ratings

(1) (2)

Operating Junction Temperature Range

LP2954AI/LP2954I

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 5 seconds)

260°C

Internally Limited

Input Supply Voltage

−20V to +30V

2 kV

(1)

Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply

when operating the device outside of its rated operating conditions.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

resistance,

using:

will go into thermal shutdown. The junction-to-ambient thermal resistance of the TO-220 (without heatsink) is 60°C/W, 73°C/W for the

DDPAK/TO-263, and 160°C/W for the SOIC-8. If the DDPAK/TO-263 package is used, the thermal resistance can be reduced by

increasing the P.C. board copper area thermally connected to the package: Using 0.5 square inches of copper area,

1 square inch of copper area,

thermal resistance is 3°C/W. If an external heatsink is used, the effective junction-to-ambient thermal resistance is the sum of the

junction-to-case resistance (3°C/W), the specified thermal resistance of the heatsink selected, and the thermal resistance of the interface

between the heatsink and the LP2954. Some typical values are listed for interface materials used with TO-220:

(4)

Human body model, 200pF discharged through 1.5k

Ω.

2

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