© 2008 Microchip Technology Inc.

DS21202H-page 25

24C02C

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office

.

PART NO.

X

/XX

Package

Temperature

Range

Device

Device:

Temperature

Range:

I= -40

°C to +85°C

E= -40

°C to +125°C

Package:

P

=

Plastic DIP (300 mil Body), 8-lead

SN

=

Plastic SOIC, (3.90 mm Body), 8-lead

ST

=

TSSOP (4.4 mm Body), 8-lead

MS

=

Plastic Micro Small Outline (MSOP), 8-lead

MC

= 2x3 DFN, 8-lead

Plastic Dual Flat (TDFN), No lead package,

2x3 mm body, 8-lead

Examples:

a)

DSTEMP-I/P:

Industrial

Temperature,

PDIP Package

b)

DSTEMP-E/SN: Extended Temperature,

SOIC Package

c)

DSTEMP-I/MNY: Industrial Temperature,

2x3 TDFN Package

Note 1: “Y” indicates a Nickel, Palladium, Gold (NiPdAu) finish.