SPECIFICATION FOR APPROVAL

DOCUMENT

: SR110000NH

REVISION

: A2

PAGE

: 5 OF 8

Mounting of the test sample onto the test board shall be either of following methods.

(1) Mounting by solder dipping

Epoxy based glue shall be applied in the middle of two lands of the test board. The

resistor shall be mounted in such a way that the electrodes of resistors will be evenly

placed in the land area and then adhesive resin shall be cured. After applying the Resin

Flux with 25 weight % Methyl Alcohol, the board shall be

soldered by dipping into a

molten solder bath with 260

± 5℃ for 3 to 5 seconds

(2) Mounting by Reflow soldering

Solder paste with approximate 200μm thickness shall be applied to the land of test board.

The resistor shall be mounted in such way that the electrodes of resistors will be evenly

placed in the land area and then shall be soldered under the circumstance that the surface

temperature of the board shall be raised 245

± 5℃(peak) for 5 to 10 seconds in an

upper-heater oven.

Material : Glass Fabric Epoxy Resin ( Refer to JIS C 6484 )

Board thickness : 1.6mm

Copper foil thickness : 0.035mm

Solder Resist Coating

Test board A ( for substrate bending test)

a

b

c

f

0.6

2.0

0.7

(2.0)

Unit : mm

100

c

b

a

f

40

Land

4.5