SPECIFICATION FOR APPROVAL

DOCUMENT

: RLI00000N

REVISION

: A1

PAGE

: 6 OF 11

5-2-2 Body Strength

Resistance Change :

± (0.5%)

Without mechanical damage such as breaks.

A load of 10N using a R0.5 pressure rod shall be applied to the center in the direction of

the arrow and held for 10

± 1 seconds.

5-2-3 Solderability

A new uniform coating of solder shall cover minimum of 95% of the surface being immersed.

Temperature of solder : 245

± 5℃

Immersion duration : 2

± 0.5 seconds

Refer to IEC 60115-1 Sub-clause 4.17.

5-2-4 Resistance to Soldering Heat

Resistance Change :

± (0.5%)

Electrical characteristics shall be satisfied.

Without distinct deformation in appearance.

(1) Solder bath method

Pre-heat : 100 to 110℃

30 seconds

Temperature : 270

± 5℃

10

± 1seconds

(2) Reflow Soldering method

Peak temperature : 260

± 5℃

10 seconds or less

Temperature : 220

± 5℃

60 seconds max.

The heating apparatus shall be the upper-heated oven and temperature shall be

the board surface temperature.

(3) Soldering iron method

Bit temperature : 350

± 5℃

3

± 1/0 seconds

The resistor shall be stored at standard atmospheric conditions for 1 hour, after

which the measurements shall be made.

Refer to IEC 60115-1 Sub-clause 4.18.

R0.5

1/2L

L

Resistor

Pressure rod

Unit : mm