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THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF Delta Electronics, Inc.

AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE

MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION

台達電子工業股份有限公司

台達電子工業股份有限公司

台達電子工業股份有限公司

台達電子工業股份有限公司

Delta Electronics, Inc.

乾坤科技股份有限公司

乾坤科技股份有限公司

乾坤科技股份有限公司

乾坤科技股份有限公司

The Engineering Spec. For 1/2W 0612

Low Resistance Chip Resistor

5. Life test

Test Item

Condition of Test

Requirements

Short Time Overload

2.5 * rated power for 5 seconds

Refer to JIS C 5201-1 4.13

∆R : ± 1.0%

Thermal Shock

-55 ~125℃ 100 cycles, 15 min at each

extreme condition

Refer to JIS C 5201-1 4.19

∆R : ± 1.0%

Low Temperature Storage

Kept at -55℃, 1,000 hours

Refer to JIS C 5201-1 4.23.4

∆R : ± 2.0%

Load Life

Rated voltage for 1.5hours followed by a

pause 0.5hour at 70

± 3℃.

Cycle repeated 1000 hours

Refer to JIS C 5201-1 4.25

∆R : ± 2.0%

Damp Heat with Load

40

± 2℃ with relative humidity 90% to

95%. Cycle repeated 1,000 hours

Refer to JIS C 5201-1 4.24

∆R : ± 2.0%

High Temperature Exposure Kept at 170℃ for 1,000 hours

Refer to JIS C 5201-1 4.23.2

∆R : ± 2.0%

Solderability

Temperature of Solder : 245

± 5℃

Immersion Duration : 3

± 0.5 seconds

Refer to JIS C 5201-1 4.17

Uniform coating of solder

cover minimum of 95%

surface being immersed

Mechanical Shock

100 G’s for 6milliseconds. 5 pulses

Refer to JIS C 5201-1 4.21

∆R : ± 1.0%

Bending Test

Glass-Epoxy board thickness : 1.6mm

Bending width : 2mm

Between the fulcrums : 90mm

Refer to JIS C 5201-1 4.33

∆R : ± 1.0%