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OP90GPZ 데이터시트(PDF) 5 Page - Analog Devices

부품명 OP90GPZ
상세설명  Precision Low-Voltage Micropower Operational Amplifier
PDF  13 Pages
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OP90GPZ 데이터시트(HTML) 5 Page - Analog Devices

  OP90GPZ Datasheet HTML 1Page - Analog Devices OP90GPZ Datasheet HTML 2Page - Analog Devices OP90GPZ Datasheet HTML 3Page - Analog Devices OP90GPZ Datasheet HTML 4Page - Analog Devices OP90GPZ Datasheet HTML 5Page - Analog Devices OP90GPZ Datasheet HTML 6Page - Analog Devices OP90GPZ Datasheet HTML 7Page - Analog Devices OP90GPZ Datasheet HTML 8Page - Analog Devices OP90GPZ Datasheet HTML 9Page - Analog Devices Next Button
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OP90
–5–
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±18 V
Differential Input Voltage . . . . [(V–) – 20 V] to [(V+) + 20 V]
Common-Mode Input Voltage . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . [(V–) – 20 V] to [(V+) + 20 V]
Output Short-Circuit Duration . . . . . . . . . . . . . . . . Indefinite
Storage Temperature Range
Package . . . . . . . . . . . . . . . . . . . . . . . . . –65
°C to +150°C
P Package . . . . . . . . . . . . . . . . . . . . . . . . . –65
°C to +150°C
Operating Temperature Range
OP90G . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40
°C to +85°C
Junction Temperature (TJ) . . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature (Soldering 60 sec) . . . . . . . . . . . . . . 300
°C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the OP90 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
Package Type
JA
2
JC
Unit
8-Lead Plastic DIP (P)
103
43
°C/W
8-Lead SO (S)
158
43
°C/W
NOTES
1Absolute Maximum Ratings apply to packaged parts, unless otherwise noted.
2
JA is specified for worst-case mounting conditions; i.e.,
JA is specified for
device in socket for
REV. C
S
P-DIP;
θ is specified for devices soldered to printed circuit
board for SO package.
JA



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