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RC2012 데이터시트(PDF) 35 Page - Samsung semiconductor

부품명 RC2012
상세설명  THICK-FILM CHIP RESISTOR
PDF  40 Pages
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제조업체  SAMSUNG [Samsung semiconductor]
홈페이지  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

RC2012 데이터시트(HTML) 35 Page - Samsung semiconductor

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34
35
Temperature
Cycle
Less than ±(1%+0.1
Ω) of the initial value.
Less than ±(3%+0.1
Ω) of the initial value.
Less than ±(3%+0.1
Ω) of the initial value.
Less than ±(3%+0.1
Ω) of the initial value.
Less than ±(3%+0.1
Ω) of the initial value.
No evidence of mechanical damage.
No evidence of mechanical damage.
No evidence of mechanical damage.
No evidence of mechanical damage.
No evidence of mechanical damage.
Load Life
Low Temp.
Exposure
High Temp.
Exposure
Moisture
Resistance
ΔR
ΔR
ΔR
ΔR
ΔR
Visual
Visual
Visual
Visual
Visual
50m
ΩMax.
50m
ΩMax.
50m
ΩMax.
50m
ΩMax.
50m
ΩMax.
JIS C 5201-1 4.19
Perform 100 cycles as follows.
Test Condition: -55
℃/ 30min ↔ 125℃/ 30min
sweep time: 5 min
Test board: <FIG. 1>
JIS C 5201-1 4.25
Test Voltage: rated voltage
Test temp.: 70±2
℃
Time: 1,000+48 hours(90 min; ON, 30 min; OFF)
Test board: <FIG. 1>
JIS C 5201-1 4.23
Dwell in -55
℃ chamber without loading for 1,000+48 hours.
Stabilize for 60 minutes at room temperature.
Measure value.
Test board: <FIG. 1>
JIS C 5201-1 4.23
Dwell in 125
℃±2℃ or 155℃±2℃chamber without
loading for 1,000+48 hours. Stabilize for 60 minutes at room
temperature.
Measure value.
Test board: <FIG. 1>
JIS C 5201-1 4.14
Test Voltage: rated voltage
Test temp.: 40±2
℃
Time: 1,000+48 hours(90 min; ON, 30 min; OFF)
Humidity: 90~95% RH
Stabilize for 1 hrs & Measure.
Test board: <FIG. 1>
Item
Requirements Specification
Test Methods
Resistor
Resistor
Jumper
Jumper
※These characteristics apply to 1
Ω~10MΩ. In case of other resistance range, please contact us.
※The next is specification in our company for flow soldering and test boards.
Time: 5~10 sec.
Time: 10 sec max.
Temp.: 260
±5℃.
Flux
Solder
Item
Specification
Dipping
ROSIN 25%, IPA 75%
Sn-3.0Ag-0.5Cu
Environmental Characteristic
Flow soldering Conditions
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
Operation
Notes
Example of land
Pattern Design
Recommended
Soldering Conditions
General Structure
General
Precision
Jumper
Low ohms
(RC Series)
Low ohms
(RUT Series)
Ultra Low Ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
Ultra Low Ohms
(RUW Series)
Arrays
(CONVEX Type)
Arrays
(CONCAVE Type)
Arrays
(FLAT Type)
Arrays for
Memory Modules
Attenuator
Characteristics
Performance
Packaging
Standard
Resistance Value



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