Copyright

© ANPEC Electronics Corp.

Rev. A.2 - Aug., 2013

APL5338A

www.anpec.com.tw

3

Symbol

Parameter

Rating

Unit

VCNTL Supply Voltage (VCNTL to GND)

-0.3 ~ 7

V

VIN Supply Voltage (VIN to GND)

V

VTT Output Voltage (VTT to GND)

V

VTTREF Output Voltage (VTTREF to GND)

V

VREF Input Voltage (VREF to GND)

-0.3 ~ 7

V

VTTSNS, S3 and S5 Voltage

-0.3 ~ 7

V

PGND to GND Voltage

-0.3 ~ 0.3

V

Maximum Junction Temperature

150

Storage Temperature Range

-65 ~ 150

Maximum Lead Soldering Temperature, 10 Seconds

260

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θ

JA

Junction-to-Ambient Resistance in Free Air

(Note 2)

MSOP-10P

TDFN3x3-10

DFN2x2-8

60

60

80

Note 2 :

θ

of MSOP-10P and TDFN3x3-10 is soldered directly on the PCB.

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability.

Symbol

Parameter

Range

Unit

VCNTL to GND

3.1 ~ 5.5

V

1.2 ~ 3.6

V

1.0 ~ 3.6

1.0 ~ 1.6

V

S3, S5 to GND

0 ~ 5.5

V

VTT Output Current

(Note 4)

-2 ~ +2

A

VIN Input Capacitor

10 ~ 100

µF

Capacitance of VTT Output Multi-layer Ceramic Capacitor (MLCC)

10 ~ 47

µF

Ambient Temperature

-40 ~ 85

Junction Temperature

-40 ~ 125

Note 3 : Refer to the typical application circuit.

Note 4 : If the VTT output current is “+2A”, then VTT source would be 2A current, and vice versa.