Copyright

© ANPEC Electronics Corp.

Rev. A.3 - Sep., 2013

APW8713

www.anpec.com.tw

3

Symbol

Parameter

Rating

Unit

VCC Supply Voltage (VCC to AGND)

-0.3 ~ 7

V

VIN Supply Voltage (VIN to AGND)

-0.3 ~ 30

V

TON Supply Voltage (TON to AGND)

-0.3 ~ 30

V

BOOT Supply Voltage (BOOT to AGND)

-0.3 ~ 37

V

BOOT Supply Voltage (BOOT to PHASE)

-0.3 ~ 7

V

AGND to PGND

-0.3 ~ +0.3

V

All Other Pins (POK, EN, FB, SS and PFM to AGND)

-0.3 ~ 7

V

LX Voltage (LX to GND)

<20ns pulse width

>20ns pulse width

-5 ~ 32

-0.3 ~ 30

V

Junction Temperature

150

Storage Temperature

-65 ~ 150

Maximum Lead Soldering Temperature(10 Seconds)

260

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability.

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θ

JA

Junction-to-Ambient Resistance in free air (Note 2)

50

Note 2:

θ

Note 3: Refer to the application circuit for further information.

Symbol

Parameter

Range

Unit

VCC Supply Voltage

4.5 ~ 5.5

V

Converter Input Voltage

2.7 ~ 28

V

Converter Output Voltage

0.8 ~ 13.2

V

Converter Output Current

0 ~ 8

A

PWM1/2 Converter Input Capacitor (MLCC)

10 ~

µF

VCC Output Capacitor (MLCC)

1.0 ~

µF

Ambient Temperature

-40 ~ 85

Junction Temperature

-40 ~ 125