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TLP523 데이터시트(PDF) 2 Page - Toshiba Semiconductor

부품명 TLP523
상세설명  Programmable Controllers DC?뭀utput Module Solid State Relay
PDF  7 Pages
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제조업체  TOSHIBA [Toshiba Semiconductor]
홈페이지  http://www.semicon.toshiba.co.jp/eng
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TLP523 데이터시트(HTML) 2 Page - Toshiba Semiconductor

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TLP523,TLP523
−2,TLP523−4
2007-10-01
2
Absolute Maximum Ratings (Ta = 25°C)
Rating
Characteristic
Symbol
TLP523
TLP523
−2
TLP523
−4
Unit
Forward current
IF
60
50
mA
Forward current derating
ΔIF /°C
−0.7 (Ta ≥ 39°C) −0.5 (Ta ≥ 25°C)
mA /°C
Pulse forward current
IFP
1 (100μs pulse, 100pps)
A
Reverse voltage
VR
5
V
Collector
−emitter voltage
VCEO
55
V
Emitter
−collector voltage
VECO
0.3
V
Collector current
IC
150
mA
Collector power dissipation
(1 circuit)
PC
150
100
mW
Collector power dissipation
derating (1 circuit (Ta ≥ 25°C))
ΔPC /°C
−1.5
−1.0
mW /°C
Operating temperature range
Topr
−55~100
°C
Storage temperature range
Tstg
−55~125
°C
Lead soldering temperature (10 s)
Tsol
260
°C
Total power dissipation
PT
250
150
mW
Total power dissipation derating
(Ta ≥ 25°C)
ΔPT /°C
−2.5
−1.5
mW /°C
Isolation voltage
(Note 1)
BVS
2500 (AC, 1min., R.H.≤ 60%)
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Device considered a two terminal device: LED side pins shorted together and detector side pins shorted
together.
Recommended Operating Conditions
Characteristic
Symbol
Min.
Typ.
Max.
Unit
Supply voltage
VCC
5
24
V
Forward current
IF
16
20
mA
Operating temperature
range
Topr
−25
85
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.



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