Copyright

© ANPEC Electronics Corp.

Rev. A.3 - Oct., 2013

www.anpec.com.tw

3

APA2012

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θ

JA

Thermal Resistance -Junction to Ambient

(Note 2)

WLCSP1.2x1.2-9

TDFN3x3-8

165

60

Note 3 : Please refer to “ Layout Recommendation”, the ThermalPad on the bottom of the IC should soldered directly to the PCB's

ThermalPad area that with several thermal vias connect to the ground plan, and the PCB is a 2-layer, 5-inch square area with 2oz

copper thickness.

Recommended Operating Conditions

Symbol

Parameter

Range

Unit

Supply Voltage

2.4 ~ 3

High Level Threshold Voltage

SD

1 ~ 3

Low Level Threshold Voltage

SD

0 ~ 0.35

V

Ambient Temperature Range

-40 ~ 85

Junction Temperature Range

-40 ~ 125

Electrical Characteristics

APA2012

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

Supply Current

No load

-

1.8

-

mA

SD High-Level Input

Curent

-

50

-

µA

SD High-Level Input

Curent

SD = 0V

-

1

-

µA

VDD shutdown supply

current

SD = 0V

-

1

2

µA

Oscillator Frequency

-

300

-

kHz

P-Channel

MOSFET

-

200

-

N-Channel

MOSFET

-

200

-

P-Channel

MOSFET

-

220

-

Static drain-source

on-state resistance

N-Channel

MOSFET

-

220

-

m

Ω

Output Offset Voltage

-

1

5

mV

Gain

Ω

V/V

OTP

Over Temperature

Protection

-

170

-

Tstart-up

Start up time

-

4

-

ms