MC10EP08, MC100EP08

http://onsemi.com

9

PACKAGE DIMENSIONS

DFN8

CASE 506AA

ISSUE E

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994 .

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.20 MM FROM TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

A

D

E

B

C

0.10

PIN ONE

2X

REFERENCE

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

A

L

(A3)

D2

E2

C

C

0.10

C

0.10

C

0.08

NOTE 4

A1

SEATING

PLANE

e/2

e

8X

K

NOTE 3

b

8X

0.10

C

0.05

C

A B

B

DIM

MIN

MAX

MILLIMETERS

A

0.80

1.00

A1

0.00

0.05

A3

0.20 REF

b

0.20

0.30

D

2.00 BSC

D2

1.10

1.30

E

2.00 BSC

E2

0.70

0.90

e

0.50 BSC

K

L

0.25

0.35

1

4

8

5

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

2.30

0.50

0.50

8X

DIMENSIONS: MILLIMETERS

0.30

PITCH

8X

1

PACKAGE

OUTLINE

RECOMMENDED

L1

DETAIL A

L

OPTIONAL

CONSTRUCTIONS

L

DETAIL B

MOLD CMPD

EXPOSED Cu

OPTIONAL

CONSTRUCTION

DETAIL B

DETAIL A

L1

−−−

0.10

0.30 REF

0.90

1.30