AD8145WYCPZ-R72 datasheet(21/24 Pages) AD

21 / 24 page

AD8145

Rev. A | Page 21 of 24

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

0.30

0.23

0.18

0.20 REF

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

12° MAX

1.00

0.85

0.80

SEATING

PLANE

COPLANARITY

0.08

0.50

0.40

0.30

3.50 REF

0.50

BSC

PIN 1

INDICATOR

TOP

VIEW

5.00

BSC SQ

4.75

BSC SQ

3.45

3.30 SQ

3.15

PIN 1

INDICATOR

0.60 MAX

0.25 MIN

EXPOSED

PAD

(BOTTOM VIEW)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 45. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

5 mm × 5 mm Body, Very Thin Quad

(CP-32-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

AD8145YCPZ-R2

−40°C to +105°C

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-32-3

AD8145YCPZ-RL

−40°C to +105°C

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-32-3

AD8145YCPZ-R7

−40°C to +105°C

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-32-3

AD8145WYCPZ-R72

−40°C to +105°C

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-32-3

1 Z = RoHS Compliant Part.

2 W = automotive qualified product.

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