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C2012 데이터시트(PDF) 71 Page - TDK Electronics

부품명 C2012
상세설명  MULTILAYER CERAMIC CHIP CAPACITORS
PDF  72 Pages
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제조업체  TDK [TDK Electronics]
홈페이지  http://www.tdk.com
Logo TDK - TDK Electronics

C2012 데이터시트(HTML) 71 Page - TDK Electronics

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TDK MLCC US Catalog
Version B11
Page 73
Packaging
Information
C Series – General Application
• Carrier Tape Configuration
Paper carrier tape
Pitch hole
Top cover tape
Bottom cover tape
Plastic carrier tape
Top cover tape
Pitch hole
• Chip Quantity Per Reel and Structure of Reel (Paper & Plastic)
Case Code
Chip
Thickness
Taping
Material
Chip quantity (pcs.)
JIS
EIA
φ178mm (7”) reel φ330mm (13”) reel
C0402 CC01005
0.20 mm
Paper
20,000
-
C0603
CC0201
0.30 mm
Paper
15,000
-
C1005
CC0402
0.50 mm
Paper
10,000
50,000
C1608
CC0603
0.80 mm
Paper
4,000
10,000
C2012
CC0805
0.60 mm
Paper/Plastic
4,000
20,000
0.85 mm
10,000
1.25 mm
Plastic
2,000
C3216
CC1206
0.60 mm
Paper
4,000
10,000
0.85 mm
Paper/Plastic
1.15 mm
Plastic
2,000
1.30 mm
1.60 mm
8,000
C3225
CC1210
1.15 mm
Plastic
2,000
10,000
1.25 mm
2,000
8,000
1.30 mm
1.60 mm
2.00 mm
1,000
5,000
2.30 mm
2.50 mm
C4532
CC1812
1.60 mm
Plastic
1,000
3,000
2.00 mm
2.30 mm
500
2.50 mm
2.80 mm
2,000
3.20 mm
C5750
CC2220
2.00 mm
Plastic
500
3,000
2.30 mm
2.50 mm
2.80 mm
2,000
• Peel Back Force (Top Tape)
0~15°
Carrier tape
Top cover tape
Direction & angle of pull
0.05 – 0.7 N
• Carrier tape shall be flexible enough to be
wound around a minimum radius of 30mm with
components in tape.
• The missing of components shall be less than
0.1%
• Components shall not stick to the cover tape.
• The cover tape shall not protrude beyond the
edges of the carrier tape not shall cover the
sprocket holes.
Paper Carrier Tape & Reel
Plastic Carrier Tape & Reel
Drawing direction
Leader
400mm min
Bulk
160mm min.
Chips
Bulk
160mm min



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