PACDN1404

http://onsemi.com

2

PACKAGE / PINOUT DIAGRAMS

Top View

(Bumps Down View)

PACDN1404

6−Bump WLCSP Package

Orientation

Marking

A

B1

B2

B3

A1

A2

A3

D14

+

B

12

3

Bottom View

(Bumps Up View)

Top View

(Bumps Down View)

PACDN1408

10−Bump WLCSP Package

A

B1

B2

B3

A1

A2

A3

DN1408

B

12

3

Bottom View

(Bumps Up View)

B4

B5

A4

A5

Orientation

Marking

+

45

SPECIFICATIONS

Table 1. ABSOLUTE MAXIMUM RATINGS

Parameter

Rating

Units

Storage Temperature Range

−65 to +150

C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

Table 2. STANDARD OPERATING CONDITIONS

Parameter

Rating

Units

Operating Temperature Range

−40 to +85

C

Symbol

Parameter

Conditions

Min

Typ

Max

Units

Reverse Standoff Voltage

5.5

V

Leakage Current

100

nA

Signal Clamp Voltage

Positive Clamp

Negative Clamp

5.6

−1.2

6.8

−0.8

8.0

−0.4

V

In−system ESD Withstand Voltage

a) Human Body Model, MIL−STD−883,

Method 3015

b) Contact Discharge per

IEC 61000−4−2 Level 4

(Note 2)

30

25

kV

Clamping Voltage during ESD Discharge

MIL−STD−883 (Method 3015), 8 kV

Positive Transients

Negative Transients

(Note 2)

+12

−8

V

C

Channel Capacitance

At 2.5 V DC, f = 1 MHz

39

47

pF

2. ESD applied to channel pins with respect to GND, one at a time. All other channels are open. All GND pins tied to ground.