MP1906DS datasheet(2/11 Pages) MPS

2 / 11 page

MP1906—80V, HALF-BRIDGE, GATE DRIVER

MP1906 Rev. 1.0

www.MonolithicPower.com

1/3/2013

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

MP1906DS

SOIC8

MP1906

*For Tape & Reel, add suffix –Z (e.g. MP1906DS–Z).

For RoHS compliant packaging, add suffix –LF (e.g. MP1906DS–LF–Z)

PACKAGE REFERENCE

VCC

HPWM

LPWM

GND

TOP VIEW

ABSOLUTE MAXIMUM RATINGS

(1)

Input Voltage VCC ..........................-0.3V to +18V

Voltage on SW VSW.............................................

-0.3V (-5V < 10ns) to +100V

Voltage on BT VBT.............................. VSW +18V

Logic Inputs ........................................................

-0.3 to (VCC+6.5V), or 18.5V for VCC ≥ 12V

Continuous Power Dissipation (TA = 25°C)

(2)

………………………………………………...1.4W

Junction Temperature.............. -40°C to +150°C

Lead Temperature (Solder 10sec)............260°C

Storage Temperature............... -55°C to +150°C

Recommended Operating Conditions

(3)

Input Voltage VCC ..............................10V to 16V

Maximum Voltage on SW VSW ..................... 80V

Logic Inputs .........................................0V to VCC

Voltage slew rate on SW...................... < 50V/ns

PWM frequency .................................. < 300kHz

Operating Junction Temp. (TJ) . -40°C to 125°C

Thermal Resistance

(4)

θJA

θJC

SOIC8..................................... 90 ...... 45... °C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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