MP2670 datasheet(2/12 Pages) MPS

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MP2670 – CHARGE SYSTEM PROTECTION CIRCUIT

MP2670 Rev. 0.91

www.MonolithicPower.com

5/13/2010

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

Temperature

MP2670DQ

QFN10

(3mm x 3mm)

–40

°C to +85°C

* For Tape & Reel, add suffix –Z (g. MP2670DQ–Z).For RoHS compliant packaging, add suffix –LF (e.g.

MP2670DQ–LF–Z)

PACKAGE REFERENCE

TOP VIEW

VIN

GND

FLT

OUT

ILIM

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

ABSOLUTE MAXIMUM RATINGS (1)

VIN to GND......................................–0.3V to 30V

OUT and VB to GND........................–0.3V to 7V

Other Pins (ILIM, FLT , EN ) ..........–0.3V to 5.5V

Junction Temperature...............................150

°C

Lead Temperature (Solder).......................260

°C

Storage Temperature.............. –65

°C to +150°C

Recommended Operating Conditions

(2)

Supply Voltage VIN ..........................4.3V to 5.5V

Operating Temperature............. –40

°C to +85°C

Thermal Resistance

(3)

θJA

θJC

QFN10 (3mm x 3mm) .............50 ...... 12 ...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The device is not guaranteed to function outside of its

operating conditions.

3) Measured on JESD51-7, 4-layer PCB.

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