MP4560DN datasheet(2/19 Pages) MPS

2 / 19 page

MP4560 – 2A, 2MHz, 55V STEP-DOWN CONVERTER

MP4560 Rev. 1.0

www.MonolithicPower.com

11/5/2012

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

Package

Top Marking

MP4560DQ*

3x3 QFN10

MP4560DN**

SOIC8E

MP4560DN

* For Tape & Reel, add suffix –Z (e.g. MP4560DQ–Z).

For RoHS compliant packaging, add suffix –LF (e.g. MP4560DQ–LF–Z)

** For Tape & Reel, add suffix –Z (e.g. MP4560DN–Z).

For RoHS compliant packaging, add suffix –LF (e.g. MP4560DN–LF–Z)

PACKAGE REFERENCE

TOP VIEW

COMP

BST

VIN

FREQ

GND

EXPOSED PAD

COMP

BST

VIN

FREQ

GND

TOP VIEW

EXPOSED PAD

3x3 QFN10

SOIC8E

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage (VIN).....................–0.3V to +60V

Switch Voltage (VSW)............ –0.5V to VIN + 0.5V

BST to SW .....................................–0.3V to +5V

All Other Pins.................................–0.3V to +5V

Continuous Power Dissipation(TA = +25°C)

(2)

3x3 QFN10……………………………………2.5W

SOIC8 (Exposed Pad)………………………2.5W

Junction Temperature...............................150

°C

Lead Temperature ....................................260

°C

Storage Temperature.............. –65°C to +150

°C

Recommended Operating Conditions

(3)

Supply Voltage VIN ...........................3.8V to 55V

Output Voltage VOUT.........................0.8V to 52V

Operating Junction Temp. (TJ). -40°C to +125°C

Thermal Resistance

(4)

θJA

θJC

3x3 QFN10..............................50 ...... 12 ...

°C/W

SOIC8 (Exposed Pad) ............50 ...... 10 ...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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