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MP8761GL 데이터시트(PDF) 2 Page - Monolithic Power Systems |
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MP8761GL 데이터시트(HTML) 2 Page - Monolithic Power Systems |
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2 / 24 page ![]() MP8761 — 8A, 18V, SYNCHRONOUS STEP-DOWN CONVERTER MP8761 Rev. 1.1 www.MonolithicPower.com 2 11/4/2013 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2013 MPS. All Rights Reserved. ORDERING INFORMATION Part Number Package Top Marking MP8761GL* 13-Pin QFN(3×4mm) MP8761 MP8761GLE** 16-Pin QFN(3×4mm) MP8761E * For Tape & Reel, add suffix –Z (e.g. MP8761GL–Z) ** For Tape & Reel, add suffix –Z (e.g. MP8761GLE–Z) Note: The 16-pin QFN package is preferred and recommended for new designs PACKAGE REFERENCE TOP VIEW PGND 4 IN 2 BST 11 12 13 910 8 7 6 VCC PG AGND SS FB FREQ EN PGND SW 3 1 SW 5 TOP VIEW 13-Pin QFN (3x4mm) 16-Pin QFN (3x4mm) ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage VIN ....................................... 21V VSW....................................... −0.3V to VIN + 0.3V VSW (30ns).................................. −3V to VIN + 3V VBST ...................................................... VSW + 6V Enable Current IEN (2..................................................... 2.5mA All Other Pins.................................–0.3V to +6V Continuous Power Dissipation (TA=+25°) (3) QFN3×4 ..................................................... 2.7W Junction Temperature...............................150°C Lead Temperature ....................................260°C Storage Temperature.............. −65°C to +150°C Recommended Operating Conditions (4) Supply Voltage VIN ...........................4.5V to 18V Output Voltage VOUT.....................0.611V to 13V IEN .............................................................. 1mA Operating Junction Temp. (TJ).−40°C to +125°C Follow Layout Recommendation for Best Performance Thermal Resistance (5) θJA θJC QFN (3×4mm)......................... 46 ....... 9.... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) Refer to the section “Configuring the EN Control”. 3) The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD(MAX)=(TJ(MAX)- TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 4) The device is not guaranteed to function outside of its operating conditions. 5) Measured on JESD51-7, 4-layer PCB. |
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