“COOLMOS” comprise a new family of transistors developed by Infineon Technologies AG.

“COOLMOS” is a trademark of Infineon Technologies AG”

ASPM®, Power MOS V®, Power MOS 7® & T-MAX® are registered trademarks of Microsemi Corporation

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Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions

for communications, defense & security, aerospace and industrial markets. Products include high-performance,

radiation-hardened and highly reliable analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power

management products; timing and voice processing devices; RF solutions; discrete components; security

technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design

capabilities and services.

Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more

at www.microsemi.com.

CONTENTS

HIGH VOLTAGE SMPS TRANSISTORS

Page No.

IGBTs (Insulated Gate Bipolar Transistors)......................................................................3-5

Ultra Low Gate Charge MOSFETs ...................................................................................... 9

High Voltage Linear MOSFETs ......................................................................................... 10

DIODES

SiC Schottky and Ultra Fast Recovery Diodes ............................................................11-13

HIGH VOLTAGE RF MOSFETS........................................................................................ 14

DRIVER-RF MOSFET HYBRIDS ...................................................................................... 14

HIGH FREQUENCY RF MOSFETS .................................................................................. 15

REFERENCE DESIGN KIT .............................................................................................. 15

POWER MODULES

Contents.......................................................................................................................... 16

Electrical Configuration ................................................................................................... 17

Packaging........................................................................................................................ 18

Know How and Capabilities .......................................................................................19-20

Part Numbering System ................................................................................................... 21

IGBTs (Insulated Gate Bipolar Transistors) ................................................................22-26

MOSFETs ....................................................................................................................27-31

Renewable Energy Power Modules ............................................................................31-32

SiC Power Modules.....................................................................................................33-35

Diodes and Rectifiers .................................................................................................36-38

PACKAGE OUTLINE DRAWINGS.............................................................................. 39-43