AD5547/AD5557

Data Sheet

Rev. D | Page 20 of 20

OUTLINE DIMENSIONS

38

20

19

1

9.80

9.70

9.60

PIN 1

SEATING

PLANE

0.15

0.05

0.50

BSC

1.20

MAX

0.27

0.17

0.20

0.09

8°

0°

4.50

4.40

4.30

6.40 BSC

0.70

0.60

0.45

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-BD-1

Figure 26. 38-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-38)

Dimension s shown in millimeters

ORDERING GUIDE

Model1

Resolution (Bits)

DNL

(LSB)

INL

(LSB)

Temperature Range

Package Description

Package

Option

Ordering

Quantity

AD5547BRU

16

±1

±2

−40°C to +125°C

38-Lead TSSOP

RU-38

50

AD5547BRU-REEL7

16

±1

±2

−40°C to +125°C

38-Lead TSSOP

RU-38

1,000

AD5547BRUZ

16

±1

±2

−40°C to +125°C

38-Lead TSSOP

RU-38

50

AD5547CRUZ

16

±1

±1

−40°C to +125°C

38-Lead TSSOP

RU-38

50

AD5547CRUZ-REEL7

16

±1

±1

−40°C to +125°C

38-Lead TSSOP

RU-38

1,000

AD5557CRU

14

±1

±1

−40°C to +125°C

38-Lead TSSOP

RU-38

50

AD5557CRU-REEL7

14

±1

±1

−40°C to +125°C

38-Lead TSSOP

RU-38

1,000

AD5557CRUZ

14

±1

±1

−40°C to +125°C

38-Lead TSSOP

RU-38

50

©2004–2012 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D04452-0-11/12(D)