| 전자부품 데이터시트 검색엔진 |
|
TC1017 데이터시트(PDF) 14 Page - Microchip Technology |
|
|
|||||||||||||||||||||||||||||
TC1017 데이터시트(HTML) 14 Page - Microchip Technology |
|
14 / 22 page ![]() TC1017 DS21813D-page 14 © 2005 Microchip Technology Inc. FIGURE 5-3: Power Dissipation vs. Ambient Temperature (SOT-23 Package). FIGURE 5-4: Maximum Current vs. Ambient Temperature (SOT-23 Package). 5.4 Layout Considerations The primary path for heat conduction out of the SC-70/ SOT-23 package is through the package leads. Using heavy wide traces at the pads of the device will facili- tate the removal of the heat within the package, thus lowering the thermal resistance R θJA. By lowering the thermal resistance, the maximum internal power dissi- pation capability of the package is increased. FIGURE 5-5: SC-70 Package Suggested Layout. 0 100 200 300 400 500 600 700 -40 -15 10 35 60 85 110 Ambient Temperature (°C) 0 20 40 60 80 100 120 140 160 -40 -15 10 35 60 85 110 Ambient Temperature (°C) VIN - VOUT = 1V SHDN U1 V IN V OUT GND C1 C2 |
|
|
링크 URL |
| ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크 투 데이터시트 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |