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NB650GL 데이터시트(PDF) 2 Page - Monolithic Power Systems |
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NB650GL 데이터시트(HTML) 2 Page - Monolithic Power Systems |
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2 / 20 page ![]() NB650/NB650H – 6A, 28V, FAST-TRANSIENT, SYNCHRONOUS STEP-DOWN CONVERTERS NB650/NB650H Rev. 1.12 www.MonolithicPower.com 2 10/11/2012 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2012 MPS. All Rights Reserved. ORDERING INFORMATION Part Number Package Top Marking NB650GL* NB650 NB650HGL** QFN17 (3 x 4mm) NB650H * For Tape & Reel, add suffix –Z (e.g. NB650GL–Z) ** For Tape & Reel, add suffix –Z (e.g. NB650HGL–Z) PACKAGE REFERENCE TOP VIEW SW SW IN GND GND BST PG EN VID1 VID2 VCC AGND SS FREQ RFB1 FB RFB2 IN GND GND SW SW 1 2 34 8 7 6 5 9 10 11 12 13 14 15 16 17 EXPOSED PAD ON BACKSIDE QFN17 (3x4mm) ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage VIN ....................................... 28V VSW........................................-0.3V to VIN + 0.3V VSW..............................-3V to VIN + 3V for <30ns VBST ...................................................... VSW + 6V All Other Pins..................................-0.3V to +6V Continuous Power Dissipation (TA = +25°C) (2) QFN17 ….……………………… ……….2.4W Junction Temperature...............................150°C Lead Temperature ....................................260°C Storage Temperature............... -65°C to +150°C Recommended Operating Conditions (3) Supply Voltage VIN ........................4.5V to 22.5V Output Voltage VOUT.........................0.6V to 13V Operating Junction Temp. (TJ). -40°C to +125°C Thermal Resistance (4) θJA θJC QFN17(3 x 4mm) ....................52 .... 11 .. °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD(MAX)=(TJ(MAX)- TA)/ θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
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