AD9549APCBZ datasheet(41/76 Pages) AD

41 / 76 page

AD9549

Rev. D | Page 41 of 76

THERMAL PERFORMANCE

Table 9. Thermal Parameters

Symbol

Thermal Characteristic Using a JEDEC51-7 Plus JEDEC51-5 2S2P Test Board

Value

Unit

Junction-to-ambient thermal resistance, 0.0 m/sec air flow per JEDEC JESD51-2 (still air)

25.2

°C/W

JMA

Junction-to-ambient thermal resistance, 1.0 m/sec air flow per JEDEC JESD51-6 (moving air)

22.0

°C/W

JMA

Junction-to-ambient thermal resistance, 2.0 m/sec air flow per JEDEC JESD51-6 (moving air)

19.8

°C/W

Junction-to-board thermal resistance, 1.0 m/sec air flow per JEDEC JESD51-8 (moving air)

13.9

°C/W

Junction-to-case thermal resistance (die-to-heat sink) per MIL-Std 883, Method 1012.1

1.7

°C/W

Junction-to-top-of-package characterization parameter, 0 m/sec air flow per JEDEC JESD51-2 (still air)

0.1

°C/W

The AD9549 is specified for a case temperature (TCASE). To ensure

that TCASE is not exceeded, an airflow source can be used.

Use the following equation to determine the junction tempera-

ture on the application PCB:

TJ = TCASE + (ΨJT × PD)

where:

TJ is the junction temperature (°C).

TCASE is the case temperature (°C) measured by customer at top

center of package.

ΨJT is the value from Table 9.

PD is the power dissipation (see the Total Power Dissipation

parameter in the Specifications section).

Values of θJA are provided for package comparison and PCB

design considerations. θJA can be used for a first-order

approximation of TJ by the equation

TJ = TA + (θJA × PD)

where TA is the ambient temperature (°C).

Values of θJC are provided for package comparison and PCB

design considerations when an external heat sink is required.

Values of θJB are provided for package comparison and PCB

design considerations.

The values in Table 9 apply to both 64-lead package options.

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