Document Number: 94285

For technical questions, contact: diodes-tech@vishay.com

www.vishay.com

Revision: 12-Jun-07

5

MBR15..CTPbF Series

Schottky Rectifier

Vishay High Power Products

Notes

1. Dimensioning and tolerancing as per ASME Y 14.5 M - 1994

2. Lead dimension and finish uncontrolled in L1

3. Dimension D, D1 and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured

at the outermost extremes of the plastic body

4. Dimension b1, b3 and c1 apply to base metal only

5. Controlling dimensions: inches

6. Thermal pad contour optional within dimensions E, H1, D2 and E1

7. Dimensions E2 x H1 define a zone where stamping and singulation irregularities are allowed

8. Outline conforms to JEDEC TO-220, except A2 (maximum) and D2 (minimum) where dimensions are derived from the actual package outline

OUTLINE DIMENSIONS in millimeters (inches)

SYMBOL

MILLIMETERS

INCHES

NOTES

SYMBOL

MILLIMETERS

INCHES

NOTES

MIN.

MAX.

MIN.

MAX.

MIN.

MAX.

MIN.

MAX.

A

3.56

4.83

0.140

0.190

D2

11.68

12.88

0.460

0.507

6

A1

0.51

1.40

0.020

0.055

E

9.65

10.67

0.380

0.420

3, 6

A2

2.03

2.92

0.080

0.115

E1

6.86

8.89

0.270

0.350

6

b

0.38

1.01

0.015

0.040

E2

-

0.76

-

0.030

7

b1

0.38

0.97

0.015

0.038

4

e

2.54 BSC

0.100 BSC

b2

1.14

1.78

0.045

0.070

e1

5.08 BSC

0.200 BSC

b3

1.14

1.73

0.045

0.068

4

H1

5.84

6.86

0.230

0.270

6, 7

c

0.36

0.61

0.014

0.024

L

12.70

14.73

0.500

0.580

c1

0.36

0.56

0.014

0.022

4

L1

-

6.35

-

0.250

2

D

14.22

16.51

0.560

0.650

3

Ø P

3.54

4.08

0.139

0.161

D1

8.38

9.02

0.330

0.355

Q

2.54

3.42

0.100

0.135

13

2

D

D1

H1

Q

13

2

C

C

D

D

3 x b2

3 x b

(b, b2)

b1, b3

(H1)

D2

Detail B

C

A

B

L

e1

Lead tip

E

E2

Ø P

0.014

A

B

M

M

0.015

A

B

M

M

Seating

plane

c

A2

A1

A

A

A

Lead Assignments

HEXFET

1. - Gate

2. - Drain

3. - Source

Conforms to JEDEC outline TO-220AB

6

6

7

6

7

e

2 x

L1

2

Detail B

Section C-C & D-D

View A-A

Base metal

Plating

4

4

c1

c

Thermal

pad

(E)

E1

6

Diodes

1. - Anode/open

2. - Cathode

3. - Anode

6

IGBTs Copak

1. - Gate

2. - Collector

3. - Emitter