ADP1650ACBZ-R7 datasheet(29/32 Pages) AD

29 / 32 page

ADP1650

Rev. C | Page 29 of 32

OUTLINE DIMENSIONS

0.660

0.602

0.544

1.54

1.50

1.46

2.04

2.00

1.96

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

0.330

0.310

0.290

1.50

REF

SEATING

PLANE

1.00

REF

0.50

REF

0.380

0.352

0.324

0.280

0.250

0.220

0.04 MAX

COPLANARITY

0.022

REF

BALL A1

IDENTIFIER

Figure 47. 12-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-12-4)

Dimensions shown in millimeters

2.48

2.38

2.23

0.50

0.40

0.30

TOP VIEW

0.30

0.25

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

SEATING

PLANE

0.80

0.75

0.70

1.74

1.64

1.49

0.20 REF

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

PIN 1

INDICATOR

(R 0.15)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 48. 10-Lead Lead Frame Chip Scale Package [LFCSP_WD]

3 mm × 3 mm Body, Very Very Thin, Dual Lead

(CP-10-9)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option2

Branding

ADP1650ACBZ-R7

−40°C to +125°C

12-Ball Wafer Level Chip Scale Package [WLCSP]

CB-12-4

LE4

ADP1650ACPZ-R7

−40°C to +125°C

10-Lead Frame Chip Scale Package [LFCSP_WD]

CP-10-9

LGX

ADP1650CB-EVALZ

Evaluation Board WLCSP Package

ADP1650CP-EVALZ

Evaluation Board LFCSP Package

1 Z = RoHS Compliant Part.

2 This package option is halide free.

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