ADP3335

Data Sheet

Rev. D | Page 12 of 16

OUTLINE DIMENSIONS

TOP VIEW

8

1

5

4

0.30

0.25

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

SEATING

PLANE

0.80

0.75

0.70

1.55

1.45

1.35

1.84

1.74

1.64

0.203 REF

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COPLANARITY

0.08

0.50

0.40

0.30

COMPLIANT

PIN 1

INDICATOR

(R 0.15)

Figure 26. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]

3 mm × 3 mm Body, Very Very Thin, Dual Lead

(CP-8-13)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-187-AA

6°

0°

0.80

0.55

0.40

4

8

1

5

0.65 BSC

0.40

0.25

1.10 MAX

3.20

3.00

2.80

COPLANARITY

0.10

0.23

0.09

3.20

3.00

2.80

5.15

4.90

4.65

PIN 1

IDENTIFIER

15° MAX

0.95

0.85

0.75

0.15

0.05

Figure 27. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters