CD00237391 datasheet(14/177 Pages) STMICROELECTRONICS

14 / 177 page

Comm. interfaces

SPI/(I2S)

3 (2)(2)

I2C

USART

UART

USB OTG FS

Yes

USB OTG HS

Yes

CAN

Camera interface

Yes

GPIOs

114

140

SDIO

Yes

12-bit ADC

Number of channels

12-bit DAC

Number of channels

Yes

Maximum CPU frequency

120 MHz

Operating voltage

1.8 V to 3.6 V(3)

Operating temperatures

Ambient temperatures: –40 to +85 °C/–40 to +105 °C

Junction temperature: –40 to + 125 °C

Package

LQFP100

LQFP144

LQFP176/

UFBGA176

For the LQFP100 package, only FSMC Bank1 or Bank2 are available. Bank1 can only support a multiplexed NOR/PSRAM memory using the NE1 Chip Select. Bank2 can

only support a 16- or 8-bit NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not available in this package.

The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I2S audio mode.

VDD minimum value is 1.7 V when the device operates in the 0 to 70 °C temperature range and IRROFF is set to VDD.

Table 3.

STM32F207xx features and peripheral counts (continued)

Peripherals

STM32F207Vx

STM32F207Zx

STM32F207Ix

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