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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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STM32F217ZG 데이터시트(PDF) 13 Page - STMicroelectronics |
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STM32F217ZG 데이터시트(HTML) 13 Page - STMicroelectronics |
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13 / 173 page  Operating temperatures Ambient temperatures: –40 to +85 °C /–40 to +105 °C Junction temperature: –40 to + 125 °C Package LQFP64 LQFP100 LQFP144 LQFP100 LQFP144 UFBGA176, LQFP176 1. For the LQFP100 package, only FSMC Bank1 or Bank2 are available. Bank1 can only support a multiplexed NOR/PSRAM memory using the NE1 Chip Select. Bank2 can only support a 16- or 8- bit NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not available in this package. 2. Camera interface and Ethernet are available only in STM32F217x devices. 3. The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I2S audio mode. Table 2. STM32F215xx and STM32F217xx: features and peripheral counts (continued) Peripherals STM32F215Rx STM32F215Vx STM32F215Zx STM32F217Vx STM32F217Zx STM32F217Ix |
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