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STM32F407IG 데이터시트(PDF) 66 Page - STMicroelectronics

부품명 STM32F407IG
상세설명  ARM Cortex-M4 32b MCUFPU, 210DMIPS, up to 1MB Flash/1924KB RAM
PDF  167 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
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STM32F407IG 데이터시트(HTML) 66 Page - STMicroelectronics

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Electrical characteristics
STM32F405xx, STM32F407xx
66/167
Doc ID 022152 Rev 2
VCAP1
When the internal regulator is ON,
VCAP_1 and VCAP_2 pins are used to
connect a stabilization capacitor.
When the internal regulator is OFF
(BYPASS_REG connected to VDD),
VCAP_1 and VCAP_2 must be supplied
from 1.2 V.
1.1
1.3
V
VCAP2
PD
Power dissipation at TA = 85 °C for
suffix 6 or TA = 105 °C for suffix 7
(6)
LQFP64
-
435
mW
LQFP100
-
465
LQFP144
-
500
LQFP176
-
526
UFBGA176
-
513
TA
Ambient temperature for 6 suffix
version
Maximum power dissipation
–40
85
°C
Low power dissipation(7)
–40
105
Ambient temperature for 7 suffix
version
Maximum power dissipation
–40
105
°C
Low power dissipation(7)
–40
125
TJ
Junction temperature range
6 suffix version
–40
105
°C
7 suffix version
–40
125
1.
The average expected gain in power consumption when VOS = 0 compared to VOS = 1 is around 10% for the whole
temperature range, when the system clock frequency is between 30 and 144 MHz.
2.
If an inverted reset signal is applied to PDR_ON, this value can be lowered to 1.7 V when the device operates in a reduced
temperature range (0 to 70 °C).
3.
When the ADC is used, refer to Table 65: ADC characteristics.
4.
If VREF+ pin is present, it must respect the following condition: VDDA-VREF+ < 1.2 V.
5.
It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV between VDD and
VDDA can be tolerated during power-up and power-down operation.
6.
If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax.
7.
In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax.
Table 11.
General operating conditions (continued)
Symbol
Parameter
Conditions
Min
Max
Unit



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