| 전자부품 데이터시트 검색엔진 |
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ASM2012CB 데이터시트(PDF) 6 Page - Aplus Intergrated Circuits |
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ASM2012CB 데이터시트(HTML) 6 Page - Aplus Intergrated Circuits |
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6 / 7 page ![]() ASM2012CB Rev 1.0 2002/07/12 5 1.4 Bonding Diagram Substrate must be connected to GND. ASM2012CB Pad Location Chip Size: X= 1540+80 (um), Y=1780+80 (um) PAD # PAD Name X Y PAD # PAD Name X Y 1 RA3 -682.16 -772.68 11 RB3 674.88 -772.68 2 RA2 -559.84 -772.68 12 OSC 633.56 804 3 RA1 -437.52 -772.68 13 TEST 432.48 804 4 RA0 -315.2 -772.68 14 VDD2 273.16 804 5 VDD1 -191.28 -772.68 15 GND2 134.68 804 6 COUT 71.12 -772.68 16 RC0 -51.76 804 7 GND1 189.52 -772.68 17 RC1 -248.4 804 8 RB0 307.92 -772.68 18 RC2 -454.24 804 9 RB1 430.24 -772.68 19 RC3 -650.88 804 10 RB2 552.56 -772.68 19 18 17 16 15 14 13 12 RC3 RC2 RC1 RC0 GND2 VDD2 TEST OSC ASM2012CB RA3 RA2 RA1 RA0 VDD1 COUT GND1 RB0 RB1 RB2 RB3 1 2 3 4 5 6 7 8 9 10 11 ( 64K x 10-bit ) Block ROM X= 1540+80 (um) Y=1780+80 (um) |
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