LM6171 datasheet(21/30 Pages) TI

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LM6171

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SNOS745C – MAY 1998 – REVISED MARCH 2013

Thermal resistance,

θJA, depends on parameters such as die size, package size and package material. The

smaller the die size and package, the higher

θJA becomes. The 8-pin PDIP package has a lower thermal

resistance (108°C/W) than that of 8-pin SOIC-8 (172°C/W). Therefore, for higher dissipation capability, use an 8-

pin PDIP package.

The total power dissipated in a device can be calculated as:

PD = PQ + PL

(3)

PQ is the quiescent power dissipated in a device with no load connected at the output. PL is the power dissipated

in the device with a load connected at the output; it is not the power dissipated by the load.

Furthermore,

PQ = supply current × total supply voltage with no load

PL = output current × (voltage difference between supply voltage and output voltage of the same supply)

For example, the total power dissipated by the LM6171 with VS = ±15V and output voltage of 10V into 1 kΩ load

resistor (one end tied to ground) is

PD = PQ + PL

= (2.5 mA) × (30V) + (10 mA) × (15V

− 10V)

= 75 mW + 50 mW

= 125 mW

APPLICATION CIRCUITS

Figure 63. Fast Instrumentation Amplifier

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