ADP1706/ADP1707/ADP1708

Rev. 0 | Page 5 of 20

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

IN to GND

−0.3 V to +6 V

OUT to GND

–0.3 V to IN

EN to GND

–0.3 V to +6 V

SS/ADJ/TRK to GND

–0.3 V to +6 V

SENSE to GND

–0.3 V to +6 V

Storage Temperature Range

–65°C to +150°C

Operating Junction Temperature Range

–40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

Unit

8-Lead SOIC (Exposed Paddle)

58

°C/W

8-Lead 3 mm × 3 mm LFCSP (Exposed Paddle)

66

°C/W

ESD CAUTION