PIC18F242 datasheet(264/332 Pages) MICROCHIP

264 / 332 page

PIC18FXX2

DS39564C-page 262

IDD

Supply Current(2,4)

D010

PIC18LFXX2

—

1.2

1.5

.75

1.25

XT osc configuration

VDD = 2.0V, +25

°C, FOSC = 4 MHz

VDD = 2.0V, -40

°C to +85°C, FOSC = 4 MHz

VDD = 4.2V, -40

°C to +85°C, FOSC = 4 MHz

RC osc configuration

VDD = 2.0V, +25

°C, FOSC = 4 MHz

VDD = 2.0V, -40

°C to +85°C, FOSC = 4 MHz

VDD = 4.2V, -40

°C to +85°C, FOSC = 4 MHz

RCIO osc configuration

VDD = 2.0V, +25

°C, FOSC = 4 MHz

VDD = 2.0V, -40

°C to +85°C, FOSC = 4 MHz

VDD = 4.2V, -40

°C to +85°C, FOSC = 4 MHz

D010

PIC18FXX2

—

1.2

1.5

1.6

.75

1.5

XT osc configuration

VDD = 4.2V, +25

°C, FOSC = 4 MHz

VDD = 4.2V, -40

°C to +85°C, FOSC = 4 MHz

VDD = 4.2V, -40

°C to +125°C, FOSC = 4 MHz

RC osc configuration

VDD = 4.2V, +25

°C, FOSC = 4 MHz

VDD = 4.2V, -40

°C to +85°C, FOSC = 4 MHz

VDD = 4.2V, -40

°C to +125°C, FOSC = 4 MHz

RCIO osc configuration

VDD = 4.2V, +25

°C, FOSC = 4 MHz

VDD = 4.2V, -40

°C to +85°C, FOSC = 4 MHz

VDD = 4.2V, -40

°C to +125°C, FOSC = 4 MHz

D010A

PIC18LFXX2

—14

μA

LP osc, FOSC = 32 kHz, WDT disabled

VDD = 2.0V, -40

°C to +85°C

D010A

PIC18FXX2

—

100

μA

LP osc, FOSC = 32 kHz, WDT disabled

VDD = 4.2V, -40

°C to +85°C

VDD = 4.2V, -40

°C to +125°C

22.1

DC Characteristics: PIC18FXX2 (Industrial, Extended)

PIC18LFXX2 (Industrial) (Continued)

PIC18LFXX2

(Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

≤ TA ≤ +85°C for industrial

PIC18FXX2

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

≤ TA ≤ +85°C for industrial

-40°C

≤ TA ≤ +125°C for extended

Param

No.

Symbol

Characteristic

Min

Typ

Max Units

Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: This is the limit to which VDD can be lowered in SLEEP mode, or during a device RESET, without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin

loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an

impact on the current consumption.

The test conditions for all IDD measurements in active Operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD

MCLR = VDD; WDT enabled/disabled as specified.

3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is

measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS, and all

features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR,...).

4: For RC osc configuration, current through REXT is not included. The current through the resistor can be

estimated by the formula Ir = VDD/2REXT (mA) with REXT in kOhm.

5: The LVD and BOR modules share a large portion of circuitry. The

ΔIBOR and ΔILVD currents are not additive.

Once one of these modules is enabled, the other may also be enabled without further penalty.

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