www.austriamicrosystems.com/LDOs/AS1369

Revision 1.7

15 - 21

AS1369

Datasheet - Application In form atio n

8.4 Junction Temperature

Under all operating conditions, the maximum junction temperature should not be allowed to exceed 125°C (unless otherwise specified in the

datasheet). Limiting the maximum junction temperature requires knowledge of the heat path from junction to case (

manufacturer), and adjustment of the case to ambient heat path (

Figure 48. Package Physical Arrangements

Figure 49. Steady State Heat Flow Equivalent Circuit

Total Thermal Path Resistance:

R

(EQ 7)

(EQ 8)

Chip

PCB

Package

Transfer Layer

CS-WLP Package

Solder Balls

Junction

Package

PCB/Heatsink

Ambient

Chip

Power

R

R

R