IO96NDB2V1 datasheet(28/242 Pages) MICROSEMI

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ProASIC3L DC and Switching Characteristics

2-12

Revision 13

Table 2-16 • Summary of I/O Output Buffer Power (per pin) – Default I/O Software Settings 1

Applicable to Advanced I/O Banks

CLOAD (pF)

VCCI (V)

Static Power

PDC7 (mW)2

Dynamic Power

PAC10 (µW/MHz)3

Single-Ended

3.3 V LVTTL / 3.3 V LVCMOS

3.3

–

141.97

2.5 V LVCMOS

2.5

–

79.98

1.8 V LVCMOS

1.8

–

52.26

1.5 V LVCMOS (JESD8-11)

1.5

–

35.62

1.2 V LVCMOS

1.2

–

21.29

3.3 V PCI

3.3

–

201.02

3.3 V PCI-X

3.3

–

201.02

Differential

LVDS

–

2.5

7.74

89.71

LVPECL

–

3.3

19.54

167.54

Notes:

1. Dynamic power consumption is given for standard load and software default drive strength and output slew.

2. PDC7 is the static power (where applicable) measured on VCCI.

3. PAC10 is the total dynamic power measured on VCCI.

Table 2-17 • Summary of I/O Output Buffer Power (per pin) – Default I/O Software Settings 1

Applicable to Standard Plus I/O Banks

CLOAD (pF)

VCCI (V)

Static Power

PDC7 (mW)2

Dynamic Power

PAC10 (µW/MHz)3

Single-Ended

3.3 V LVTTL / 3.3 V LVCMOS

3.3

–

125.97

2.5 V LVCMOS

2.5

–

70.82

1.8 V LVCMOS

1.8

–

36.39

1.5 V LVCMOS (JESD8-11)

1.5

–

25.34

1.2 V LVCMOS

1.2

–

16.24

3.3 V PCI

3.3

–

184.92

3.3 V PCI-X

3.3

–

184.92

Notes:

1. Dynamic power consumption is given for standard load and software default drive strength and output slew.

2. PDC7 is the static power (where applicable) measured on VCCI.

3. PAC10 is the total dynamic power measured on VCCI.

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