PIC16F84A datasheet(201/337 Pages) MICROCHIP

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DS30234D-page 201

PIC16C6X

Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67

19.2

DC Characteristics:

PIC16LC62A/R62/64A/R64-04 (Commercial, Industrial)

DC CHARACTERISTICS

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40˚C

≤ TA ≤ +85˚C for industrial and

0˚C

≤ TA ≤ +70˚C for commercial

Param

No.

Characteristic

Sym

Min

Typ† Max Units

Conditions

D001

Supply Voltage

VDD

2.5

6.0

LP, XT, RC osc conﬁguration (DC - 4 MHz)

D002*

RAM Data Retention Volt-

age (Note 1)

VDR

1.5

D003

VDD start voltage to

ensure internal Power-on

Reset signal

VPOR

-VSS

See section on Power-on Reset for details

D004*

VDD rise rate to ensure

internal Power-on Reset

signal

SVDD

0.05

V/ms See section on Power-on Reset for details

D005

Brown-out Reset Voltage

BVDD

3.7

4.0

4.3

BODEN bit in conﬁguration word enabled

D010

D010A

D015*

Supply Current (Note 2, 5)

Brown-out Reset Current

(Note 6)

IDD

∆IBOR

2.0

22.5

350

3.8

425

µA

XT, RC osc conﬁguration

FOSC = 4 MHz, VDD = 3.0V (Note 4)

LP osc conﬁguration

FOSC = 32 kHz, VDD = 3.0V, WDT disabled

BOR enabled, VDD = 5.0V

D020

D021

D021A

D023*

Power-down Current

(Note 3, 5)

Brown-out Reset Current

(Note 6)

IPD

∆IBOR

7.5

0.9

350

425

µA

VDD = 3.0V, WDT enabled, -40

°C to +85°C

VDD = 3.0V, WDT disabled, 0

°C to +70°C

VDD = 3.0V, WDT disabled, -40

°C to +85°C

BOR enabled, VDD = 5.0V

These parameters are characterized but not tested.

†

Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and

are not tested.

Note 1: This is the limit to which VDD can be lowered without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin

loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an

impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD

MCLR = VDD; WDT enabled/disabled as speciﬁed.

3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-

sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.

4: For RC osc conﬁguration, current through Rext is not included. The current through the resistor can be esti-

mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.

5: Timer1 oscillator (when enabled) adds approximately 20

µA to the speciﬁcation. This value is from character-

ization and is for design guidance only. This is not tested.

6: The

∆ current is the additional current consumed when this peripheral is enabled. This current should be added

to the base IDD or IPD measurement.

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