AS2533F datasheet(24/26 Pages) AMSCO

부품명	AS2533F

상세설명	Multi-Standard CMOS Telephone IC for Basic Telephones

PDF	26 Pages

Scroll/Zoom	100%

제조업체	AMSCO [ams AG]

홈페이지	http://www.ams.com

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24 / 26 page

Data She et AS25 33-36

austriamicrosystems

Revision 8.10

Page 23 of 25

Conditions for Delivery as Dice on Foil, sawn

Die thickness

380

± 20 m

Back finishing

back grinding, silicon

Frame

Material: Plastic

Size: see figure

Frame Position Tolerance

Center wafer to frame:

± 4mm

Angle deviation wafer to frame:

± 8°

Orientation wafer to frame: Wafer flat to frame side with kerfs

Covering adhesive foil to frame: >5mm

Tape

Type: PVC with acrylic adhesive

Thickness: 70

± 20 m

Sawing conditions

Sawing mode: Saw - through mode

Sawing width: typ. 60

Kerf depth in foil: typ. 20

XV -dimension deviation: max.25

Packing

frame sealed in foil bags filled with nitrogen

Storage time In sealed bags

2 months, Tamb = 25

°C

Mechanical Drawing of Frame (valid for 200 mm and 150 mm wafer)

AS2533F 데이터시트(PDF) 24 Page - ams AG