4

®

DAC701, 702, 703

CONNECTION DIAGRAMS

–V

1

2

3

4

5

6

7

8

9

10

11

12

24

23

22

21

20

19

18

17

16

15

14

13

MSB

16-Bit

Ladder

Resistor

Network

and

Current

Switches

Digital

Inputs

Reference

Circuit

R

F

(4)

Voltage Models

Only

LSB

Digital

Inputs

(2)

+V

CC

270k

Ω

3.9M

Ω

(3)

(3)

0.0022µF

(2)

(2)

V

DD

CC

(1)

0.1

µF to 1.0µF. (3) Potentiometers are 10kΩ to

100k

Ω. (4) 5kΩ (DAC701), 10kΩ (DAC702/703).

ALL PACKAGES

PIN #

DAC702

DAC701/703

1

Bit 1 (MSB)

Bit 1 (MSB)

2

Bit 2

Bit 2

3

Bit 3

Bit 3

4

Bit 4

Bit 4

5

Bit 5

Bit 5

6

Bit 6

Bit 6

7

Bit 7

Bit 7

8

Bit 8

Bit 8

9

Bit 9

Bit 9

10

Bit 10

Bit 10

11

Bit 11

Bit 11

12

Bit 12

Bit 12

13

Bit 13

Bit 13

14

Bit 14

Bit 14

15

Bit 15

Bit 15

16

Bit 16 (LSB)

Bit 16 (LSB)

17

18

19

20

Common

Common

21

Summing Junction (Zero Adjust)

22

Gain Adjust

Gain Adjust

23

24

+6.3V Reference Output

+6.3V Reference Output

Digital Data Inputs to Common ................................................ –1V, +18V

Reference Out to Common ........................... Indefinite Short to Common

External Voltage Applied to D/A Output (DAC701/703) .......... –5V to +5V

Power Dissipation ................................................................................. 1W

Storage Temperature ...................................................... –60

°C to +150°C

Lead Temperature (soldering, 10s) ................................................. 300

°C

NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”

may cause permanent damage to the device. Exposure to absolute maximum

conditions for extended periods may affect device reliability.

PIN ASSIGNMENTS

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degrada-

tion to complete device failure. Precision integrated circuits

may be more susceptible to damage because very small

parametric changes could cause the device not to meet its

published specifications.