TSL12T, TSL13T

LIGHT-TO-VOLTAGE CONVERTERS

TAOS062D − APRIL 2007

12

r

r

Copyright E 2007, TAOS Inc.

The LUMENOLOGY r Company

www.taosinc.com

MANUFACTURING INFORMATION

The reflow profile specified here describes expected maximum heat exposure of devices during the solder

reflow process of the device on a PWB. Temperature is measured at the top of the device. Devices should be

limited to one pass through the solder reflow profile.

Table 1. TSL12T, TSL13T Solder Reflow Profile

PARAMETER

REFERENCE

TSL12T, TSL13T

Average temperature gradient in preheating

2.5°C/sec

Soak time

2 to 3 minutes

Max 60 sec

Max 50 sec

Max 10 sec

Peak temperature in reflow

260° C (−0°C/+5°C)

Temperature gradient in cooling

Max −5°C/sec

Not to scale — for reference only

Time (sec)

Figure 18. TSL12T, TSL13T Solder Reflow Profile