| 전자부품 데이터시트 검색엔진 |
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TSL3301 데이터시트(PDF) 16 Page - ams AG |
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TSL3301 데이터시트(HTML) 16 Page - ams AG |
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16 / 21 page ![]() TSL3301CL 102 × 1 LINEAR OPTICAL SENSOR ARRAY WITH ANALOG-TO-DIGITAL CONVERTER TAOS141 − JULY 2011 15 The LUMENOLOGY r Company r r Copyright E 2011, TAOS Inc. www.taosinc.com PACKAGE INFORMATION Pb TOP VIEW SIDE VIEW BOTTOM VIEW END VIEW Pin 1 1.0 0.8 2.5 0.95 0.95 0.6 0.6 1.8 7.5 + 0.08 0.22 0.085 (Note B) 8.573 (Note B) 1.2 + 0.2 9.4 + 0.2 Pin 1 3.0 + 0.2 Photodiode Array (Not to Scale) CL of Package of Photodiode Array Area (Note C) CL 0.37 Nominal 0.011 Nominal CL of Pixel 7 (Note C) Photodiode Array (Not to Scale) CL of Solder Contact NOTES: A. All linear dimensions are in millimeters. Dimension tolerance is ± 0.05 mm unless otherwise noted. B. Nominal photodiode array dimension. The array is made up of 100 inner pixels and 2 end pixels with pixel #1 closer to Pin 1. The inner pixel is 77 μm wide by 85 μm high, spaced on 85μm centers. The end pixel is 49μm wide by 132 μm high. C. The die is centered within the package within a tolerance of ± 0.05 mm. D. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.56. E. Contact finish is soft gold plated. F. This package contains no lead (Pb). G. This drawing is subject to change without notice. Figure 8. Package CL Configuration |
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